ASML Enters Advanced Packaging: The $50 Billion Opportunity Beyond EUV
ASML shipped its first advanced packaging lithography system — the TWINSCAN XT:260 — in late 2025, marking the company's strategic expansion beyond EUV. With the advanced packaging market surpassing $50 billion annually and TSMC's CoWoS capacity constraining every major AI chip program, the lithography monopolist is opening a new competitive front.
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