Materials & Fab
5 articles covering this beat
TSMC's $56 Billion Year: Inside the Largest Semiconductor Capex Budget in History
TSMC will spend up to $56 billion in 2026 — more than any semiconductor company has ever invested in a single year. We break down where the money is going, from 2nm node buildout to a fourfold expansion of advanced packaging capacity, and what it means for chip pricing and customer allocation.
TSMC Arizona Turns Profitable: What the First US Advanced Fab Means for Reshoring
TSMC's Arizona subsidiary posted NT$16.1 billion in profit in 2025 — its first profitable year — just one year after Fab 21 entered volume production. With N4 yields exceeding Taiwan benchmarks, NVIDIA Blackwell GPUs rolling off the line, and a third fab breaking ground on 2nm, the most consequential test of US semiconductor reshoring is passing.
ASML Enters Advanced Packaging: The $50 Billion Opportunity Beyond EUV
ASML shipped its first advanced packaging lithography system — the TWINSCAN XT:260 — in late 2025, marking the company's strategic expansion beyond EUV. With the advanced packaging market surpassing $50 billion annually and TSMC's CoWoS capacity constraining every major AI chip program, the lithography monopolist is opening a new competitive front.
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